LISLE, Ill. – January 29, 2009– Molex Incorporated (NASDAQ: MOLX AND MOLXA) and Neoconix have developed a flexible copper high-density and speed (HD&S) interposer in a tool-less, easy-to-use ...
A Mezzanine Array Connector Family featuring High-Speed + Power within a pitch 0.5 & 0.6mm enabling the highest DP density and best performance in the Industry! SAN JOSE, Calif., June 20, 2024 ...
Molex and Neoconix have partnered to deliver a flexible, copper-based high-density and speed (HD&S) interposer. The low-profile contact interface integrates Molex Copper Flex with Neoconix’s HD&S ...
Within the SPH1 family of standard products, Neoconix offers area-array connectors at 0.8mm pitch, 1.0mm pitch, and 1.27mm pitch, with pin counts ranging from 80 to 120 positions. Interposer ...
SAN JOSE, Calif., Aug. 22, 2023 /PRNewswire/ -- Neoconix today announced immediate availability of the new S248 35 position and S320 112 position DLP® connectors in support of the Pico DLP160AP/CP and ...
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