INTC boosts server CPU leadership as Xeon 6900 powers SMCI's 6U SuperBlade, delivering up to 128 cores, faster DDR5, and ...

The GPU made its debut at CES alongside five other data center chips. Customers can deploy them together in a rack called the Vera Rubin NVL72 that Nvidia says ships with 220 trillion transistors, ...

Florida is planning to build another immigration detention facility in the state's Panhandle, pending approval from the ...

Today at CES, Intel unveiled Intel® Core™ Ultra Series 3 processors, the first AI PC platform built on Intel 18A process ...

NVIDIA says its Rubin platform is now in full production, delivering up to 50 petaflops and powering the next wave of agentic ...

Despite the massive battery, Power2 is under 8mm thick and weighs 216 grams. It was not that long ago when any phone with a ...

If you’ve been thinking about adding storage, this is one of those deals that’s worth acting on for a second reason beyond ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Data Center Building Block Solutions (DCBBS) and Advanced Direct Liquid Cooling (DLC) Technology with Supermicro US Based ...

It may look like a laptop we all know, but MSI's latest revision of its slim gaming and power-user Stealth line could be its ...

Satya Nadella's message boldly claimed the AI discovery phase is over and demanded society focus on real-world integration.

India's Design Linked Incentive (DLI) scheme has facilitated 16 chip tape-outs and the creation of six ASIC chips, along with spurring 10 patents.